Sep 11, 2003
NORTHBROOK, Ill., August 28, 2003--The IPC Designers Council announces the schedules for its two Designers Learning Symposiums in 2003, taking place October 6-8 at the Holiday Inn Montreal Aeroport in Montreal, Quebec, Canada, and November 11-13 at the Marriott at Research Triangle Park in Raleigh, N.C.
�The printed circuit board industry is an ever-changing marketplace. The technologies of today certainly aren�t standing still, and neither should today�s PCB designer,� said Rick Hartley, CID, chairman of the IPC Designers Council. �IPC�s Designers Learning Symposiums are the perfect venues for designers to further their proficiencies and improve their marketability. They�ll not only be able to explore the latest technologies, but also network with the brightest design and process engineers throughout the industry.�
Each symposium will offer seven workshops on the necessary skills that printed circuit board (PCB) designers and others involved in engineering or manufacturing along the electronics manufacturing supply chain can immediately apply. Highlights of this year�s workshops include:
� Embedded Component Design: A Hands-on Experience
In this course, Michael Fitts, Mentor Graphics, will guide participants through an interactive embedded component design tutorial to examine the impact that embedded components will have in reducing company costs. Fitts will also provide the necessary techniques to implement various technologies at the printed circuit board level.
� Fundamentals of High-Speed Digital Design
This hands-on workshop will non-mathematically introduce signal integrity for the high-speed digital design space and focus on real-world solutions to these issues. Attendees will experiment with practical ways of dealing with high-speed phenomena through hands-on labs.
� Next Generation Interconnections: Photonics and Beyond
Happy Holden, Westwood Associates, will analyze optoelectronics and photonics: the next generation of signal interconnections for ASIC packaging, portable products, high performance computing and telecom. He will also discuss the engineering challenges, electrical performance and signal integrity issues involved in electronics.
� PCB Design for RF Applications (Raleigh Symposium only)
This course will present a practical guide to the many RF design issues facing the modern PCB designer, including the basic RF concepts of wavelength, frequency spectrum, modulation, power measurement and capacitance, inductance, resonance and impedance. Andy Kowalewski, SyChip, will also review the problems and solutions of laminate selection, stack-up planning and impedance control.
Other workshops will cover �Process Considerations in the Assembly and Design of BGAs� by Rodney Miller, Tri-Onics; �Thermal Management and Conductor Current-Carrying Capacity in Printed Circuits� by Michael Jouppi, Thermal Man, Inc.; �Challenges in Bare Die Mounting� by Larry Gilg, Dynalog Systems, Inc.; and exclusively at the Montreal Symposium, �Pad Stack Design and PCB Stack-Up Generation for High Yields� by Lee Ritchey, Speeding Edge.
Also at the Designers Learning Symposiums, Gary Ferrari, Ferrari Technical Services, will lead both a free Self Development Forum and a Design for Manufacture Off-Site Applied Training segment. The former will prepare today�s PCB designer to better market themselves on paper and within their workplace. The interactive, half-day applied training workshop will be held at a leading Interconnect Manufacturing Service/PCB company. Through multiple lectures, a panel discussion and a facility tour, PCB designers will gain a better understanding of the design philosophy for manufacturability by directly observing the processes, smelling the chemistries and touching the end product.
Additionally, the Symposiums will offer a technical conference, with papers and presentations dealing with the industry�s hottest topics, as well as a roundtable discussion on �What You Need to Know about Embedded Passives Technology to Keep Your Company Competitive,� hosted by IPC�s new Technology Subcommittee and the IPC Designers Council.
Designers who aspire to become Certified Interconnect Designers (CID) and Advanced Certified Interconnect Designers (CID+) will also be able to participate in the IPC Designer�s Council Designer Certification programs that follow both Designers Learning Symposiums. Developed to assess one�s knowledge of how to transform a schematic into a reliable rigid PCB design that can be easily manufactured, assembled and tested, these certification classes are based on several critical IPC documents that link design principles to the end product use of the printed wiring assembly.
For more information about IPC Designers Council�s two Designers Learning Symposiums in 2003, visit http://dc.ipc.org or contact Stephannie Caliendo, IPC�s Designers Council Program Manager, at Calist@ipc.org or 847-790-5302.
About the IPC Designers Council
The IPC Designers Council is a professional society of designers forming an international network. Its mission is to promote printed board and printed board assembly design as a profession and to encourage, facilitate and promote the exchange of information and integration of new design concepts through communications, seminars, workshops and professional certification through a network of local chapters. Founded in 1992, the Designers Council now serves more than 1,100 members and has certified over 1,980 designers. For more information, visit http://dc.ipc.org.
About IPC
IPC is a Northbrook, Ill.-based trade association dedicated to the competitive excellence and financial success of its more than 2,200 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of a $40 billion U.S. industry employing more than 350,000 people. IPC maintains offices in Taos, N.M.; Washington, D.C.; Garden Grove, Calif.; and Shanghai, China. For more information, visit http://www.ipc.org.
»
