To achieve the demand for higher functioning electronics assemblies, engineers must meet stringent reliability standards. Failure analysis is increasingly complex, placing needs for improved standards to detect reliability root cause problems. Doug Pauls of Rockwell Collins will discuss advances in test boards for qualifying the manufacturing process and reliability analysis. Joe Russeau of Precision Analytical Laboratory will discuss the methodologies used to evaluate cleanliness of printed wiring assemblies. Steven Perng of Cisco will discuss spot cleaning assessment under components following inline cleaning. Jack Fischer of Interconnect Technology Analysis will present the IPC Technology Roadmap Future of Interconnect Technology and its impact on cleaning for reliability.
For more information about the conference, visit http://www.ipc.org/CleaningConferenceBrochure. Visit http://www.ipc.org/CleaningConfSponsorshipApp for information about the sponsorship application, and http://www.ipc.org/CleaningConfTabletopApp for the tabletop application.