Oct 01, 2008 Engineering Test Coverage on Complex Sockets (Paper 11.1)
Augmenting Boundary-Scan Tests for Enhanced Defect Coverage (Paper 11.3)
Finding Power/Ground Defects on Connectors �V Case Study (Paper 15.2)
Boundary-Scan Testing of Power/Ground Pins (Paper 29.1)
When: October 28- 30, 2008
Where: Santa Clara, Calif., International Test Conference, Santa Clara Convention Center Halls A, B & C
Additional Information: www.itctestweek.org
www.agilent.com/see/vtep
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NOTE TO EDITORS: Further technology, corporate citizenship and executive news is available on the Agilent news site at http://www.agilent.com/go/news.
MEDIA/ANALYSTS: For any additional questions about Agilent Technologies or to schedule a briefing, contact Janet Smith at +1 970 679 5397 or janet_smith@agilent.com.
