LAPA Enterprises will now be responsible for sales of the company's entire portfolio of solder paste, solder wires, solder bars, flux products, as well as their complete line of cleaning products.
The LAPA name is widely known throughout these territories for their exceptional support and professionalism. The Balver Zinn Group Managing Director, Josef Jost, said: �LAPA has come widely recommended as a partner who can match the superior performance of our products with their wealth of knowledge and experience in electronics and semiconductor assembly. Their contribution will enable us to uphold the outstanding customer relations the Balver Zinn and Cobar brands are known for and our customers have come to expect. We look forward to a long relationship.�
The latest product in the Balver Zinn Group portfolio is the XF3 solder paste, developed to accommodate extended reflow profiles, with or without the use of nitrogen. XF3 demonstrates superior wetting performance on all common metal surfaces and exhibits a robust printing window for printing at 10 � 200 mm per second. XF3 is classified as an IPC-J-STD 004 REL0 solder paste; with safe residues that keeps the reflow oven clean. Further products are being launched throughout 2009.