GP1206 BGA Rework System
Model: |
GP1206 BGA Rework System |
Part Number: |
GP1206 BGA Rework System |
Category: |
|
Model Year: |
2016 |
Condition: |
|
Location: |
China |
Offered by: |
GP1206 BGA Rework System
Features:
1. Made of high quality heating material, desoldering and soldering procedures of BGA are precisely controlled
2. Movable heating head, able to move horizontally.
3. Embedded industrial computer, Simens PLC control, real-time profile display, able to display set and practically –tested profiles
4. Connect USB mouse.
5. Profile saving up to 50000 , could input Chinese and English
6. Temperatures of the hot air heaters could be precisely controlled , this made the rework ore reliable.
7. Local sinkage is restrained , by the soldering supporting frame.
8. Cool wind to lower heating,offered by powerful cross flow fans.
9. Adjustable PCB positioning support
10. Hand vacuum pen, for removing BGA.
11. Both upper and lower parts are equipped with over-temperature alarming and protection apparatus.
12. Software can be updated to auto-profile by USB, no need to set profiles
Parameter
PCB &Component Requirements
PCB maximum size
450 x 400 mm
Max Processing area
120 x 120 mm
Max PCB Thickness
4mm
Max component size
55 x 55 mm
Min component size
4 x 4mm
Max component weight
80g
Thermal Specification
Max hot air head temp
350 degree
Max lower IR heat
400 degree
Heat control adjustment
8-stage programmable temperature settings
Upper hot air head prower consumption
600W
Lower IR heating power consumption
800W
Lower IR heater power consumption
2700W
Dimensions & Power requirements
System dimension
660 x 630 x 600 mm, L x W x H
Weight
Approx 60kg
Power Requirements
Single-phase, 220V AC, 50/60 Hz
Company Information:
