Features
● Equipment is ergonomically in designed.
● Auto liquid feeding and draining system.
● Five levels filter system,liquid can be recycled which results in lower solvent consumption.
● Internationally recognized critical components are used to ensure...
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Cleaning Equipment |
Features:
1. Completely use compressed air as energy, there is no security risk;
2. Humanized design;
3. One-touch operation, easy to complete the cleaning and drying work;
4. nozzle precision design to ensure high cleanliness;
5. liner specially d...
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Cleaning Equipment |
Application
It's mainly used in light strip backlight detection, LED bubble detection, TV backlight LED strip
detection; It can also be applied to BGA, CSP,
Flip ceramic element, chip electronic inspection, products.Aerospace connector semiconductor, module ...
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Inspection |
Application Field
SMT/PCBA
Package type:BGA、LGA、CSP、POP、SIP...
Defect type:Void、HIP、Insufficient、Bridge...
Semiconductor
Package type:W/B、IC、F/C...
Defect type:Void、Open、Short...
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Inspection |
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc.
<...
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Inspection |
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Indus...
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Inspection |
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Indust...
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Inspection |
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Component Counters / SMD Counters |
Widely applied for BGA, CSP , Flip Chip, LED , Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industr...
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Inspection |
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Ca...
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Inspection |
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cab...
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Inspection |
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic...
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Inspection |
Application
Lithium battery pole piece solder joint defect detection,
Lithium battery batteries coiling case detection,
BGA, CSP , LED , Flip Chip , Semiconductor,
Battery Industry,Small Metal Casting,
Electronic Connector Module,
A...
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Inspection |