The world’s first true 3D pre-and post-reflow AOI system.
The Zenith 3D AOI system measures the true profilometric shape of components, solder joints, patterns and even foreign material on assembled PCBs with true 3 dimensional measurement, overcoming the shortcomings and vulner...
|
Inspection |
High-speed, High Performance 3D In-Line SPI with Dual Projection
The new KY8030-3 delivers 3x faster inspection without compromising performance and accuracy. Using patented dual projection, the system eliminates the critical Shadow problem that all 3D SPI systems can be vulnerabl...
|
Inspection |
Dual Projection 3D In-Line SPI For High-Volume, Low-Mix Production
The new KY8030-2 delivers 2x faster inspection without compromising performance and accuracy. Using patented dual projection, the system eliminates the critical Shadow problem that all 3D SPI systems can be vulnera...
|
Inspection |
High-spec & Performance 3D Post Reflow Bump Inspection System
Highly Reliable and Accurate Inspection System
No Shadow Effect & No Specular Problem
Capable of Co-Planarity / PCB Warp Inspection
...
|
Inspection |
Koh Young Technology’s new product aSPIre 3D In-line Solder Paste Inspection System adds more value to your production. Keeping with high speed SMT lines, aSPIre system helps maximizing productivity and ensures no compromise is made between speed and accurate 100% 3...
|
Inspection |
Top Quality SPI with Tabletop Convienience
The full automatic KY-3020T packs superior Koh Young inspection technology into a compact, tabletop system that delivers precise, accurate SPI results while offering portability, convenience and value.
Key features:...
|
Inspection |