Optimizing Flip Chip Substrate Layout for Assembly
Published: |
November 29, 2007 |
Author: |
Pericles Kondos, Peter Borgesen, Dan Blass, and Antonio Prats. |
Abstract: |
Programs have been developed to predict the expected yield of flip chip assemblies, based on substrate design and the statistics of actual manufactured boards, as well as placement machine accuracy, variations in bump sizes, and possible substrate warpage. These predictions and the trends they reveal can be used to direct changes in design so that defect levels will fall below the acceptable limits. Shapes of joints are calculated analytically, or when this is not possible, numerically by means of a public domain program called Surface Evolver. The method is illustrated with an example involving the substrate for a flip chip BGA.... |
|
Company Information:
More articles from Universal Instruments Corporation »
- Oct 30, 2014 - Solder Joint Reliability Under Realistic Service Conditions
- Jan 23, 2014 - Testing Intermetallic Fragility on Enig upon Addition of Limitless Cu
- Mar 04, 2013 - Process Issues For Fine Pitch CSP Rework and Scavenging
- Sep 27, 2007 - The Pin-in-Paste (or AART) Process for Odd Form and Through Hole Printed Circuit Boards
- Aug 09, 2007 - Achieving SMT Compatible Flip Chip Assembly With No-Flow Fluxing Underfills
- See all SMT / PCB technical articles from Universal Instruments Corporation »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
Optimizing Flip Chip Substrate Layout for Assembly article has been viewed 764 times