Optimizing Thermal and Mechanical Performance in PCBs
Published: |
February 4, 2008 |
Author: |
Alex Mangroli, Kris Vasoya |
Abstract: |
Engineers are always striving to make a lighter, faster and stronger PCB. In order to achieve their designs, engineers must turn to alternative materials to enhance their designs. There are many materials that allow for thermal, coefficient of thermal expansion (CTE) and rigidity. Many times if a material enables an engineer to have CTE they will have to sacrifice thermal. Currently carbon composite laminates are being used in order to achieve an ideal PCB with thermal, CTE and rigidity with almost no weight premiums.... |
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- Nov 13, 2008 - Meeting Heat And CTE Challenges Of PCBs And ICs
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