Integrated Offset Placement in Electronics Assembly Equipment - The Answer for Solder Paste Misalignment
Published: |
October 29, 2008 |
Author: |
Juki Corp. |
Abstract: |
Growing demand for compact, multi-function electronics products has accelerated component miniaturization and high-density placement, creating new challenges for the electronics manufacturing industry. It is no longer adequate to simply place parts accurately per a pre-defined CAD assembly program because solder paste alignment errors are increasing for numerous reasons. The solution to this problem is a system in which the placement machine can automatically detect and compensate for misalignment of the solder paste to produce high-quality boards regardless of the process errors beforehand.... |
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