Meeting Heat And CTE Challenges Of PCBs And ICs
Published: |
November 13, 2008 |
Author: |
Kris Vasoya, |
Abstract: |
The electronics industry is facing issues with hot spots, solder joint stresses and Coefficient of Thermal Expansion (CTE) mismatch between PCB and IC substrate. Flip chip type packages for example have very low CTE compared to traditional PCB material. Thus it is necessary to have low CTE printed circuit boards in order to keep solder joint intact with such low CTE packages. There are currently several materials available in the market to address thermal and CTE challenges but each material has its own advantages and limitations...... |
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- Feb 04, 2008 - Optimizing Thermal and Mechanical Performance in PCBs
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