01005 Production Goes Industry Wide
Published: |
July 29, 2010 |
Author: |
Satoshi Kataoka, Eric Klaver |
Abstract: |
The introduction of the 01005 chip components in 2004 was a challenge to the whole electronics equipment assembly industry. The components’ miniature size made them difficult to see, let alone place reliably with high accuracy. Designers were reluctant to... |
|
Company Information:
More articles from Assembléon »
- Mar 01, 2012 - Why Sacrifice Throughput For Change-Over Time?
- Oct 13, 2011 - Are Separate Solder Flip-Chip Bonders Still Required?
- Jul 21, 2011 - Production Line Dynamics: What Count Is What Actually Comes Out Of Your Line
- May 19, 2011 - Improve Margins By Reducing Rework - A Benchmark Comparison
- Nov 12, 2010 - Assembling the Next Electronic Equipment Generations.
- See all SMT / PCB technical articles from Assembléon »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
01005 Production Goes Industry Wide article has been viewed 509 times