Nanofluids, Nanogels and Nanopastes for Electronic Packaging
Published: |
December 22, 2010 |
Author: |
Rabindra N. Das, Varaprasad Calmidi, Mark D. Poliks and Voya R. Markovich |
Abstract: |
This paper discusses polymer based nanogels, nanofluids and nanopastes for thermal interface material (TIM) applications. Nanopaste and nanogel formulated using controlled-sized particles to fill small bond lines is highlighted.... |
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