Warpage Measurement of PCB With 3D Metrology
Published: |
June 9, 2011 |
Author: |
Craig Leising |
Abstract: |
Flatness measurement of electronic parts and assemblies, or PCB’s, has become increasingly critical as geometries become smaller: finer pitches, smaller solder ball volumes, thinner substrates, etc. Additionally, processing temperatures vary and can pla... |
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