Design and Construction Affects on PWB Reliability
Published: |
April 26, 2012 |
Author: |
Paul Reid |
Abstract: |
First presented at IPC Apex Expo 2012. The reliability, as tested by thermal cycling, of printed wire boards (PWB) are established by three variables; copper quality, material robustness and design. The copper quality was most influential and could be eva... |
|
Company Information:
More articles from PWB Interconnect Solutions Inc. »
- Jul 27, 2021 - Dielectric Material Damage Vs. Conductive Anodic Filament Formation
- Jan 21, 2021 - Reliability Testing For Microvias In Printed Wire Boards
- See all SMT / PCB technical articles from PWB Interconnect Solutions Inc. »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
Design and Construction Affects on PWB Reliability article has been viewed 627 times