A Designed Experiment for the Influence of Copper Foils on Impedance, DC Line Resistance and Insertion Loss
Published: |
March 28, 2013 |
Author: |
Alexander Ippich |
Abstract: |
For the last couple of years, the main concerns regarding the electrical performance of blank PCB boards were impedance and ohmic resistance. Just recently, the need to reduce insertion loss came up in discussions with blank board customers (...) The paper describes the test vehicle and the testing methodology and discusses in detail the electrical performance characteristics. The influence of the independent variables on the performance characteristics is presented. Finally the thermal reliability of the boards built applying different copper foils and oxide replacements was investigated.... |
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