A Novel High Thermal Conductive Underfill For Flip Chip Appliation
Published: |
February 27, 2014 |
Author: |
Dr. Mary Liu and Dr. Wusheng Yin |
Abstract: |
Silicon dioxide is normally used as filler in underfill. The thermal conductivity of underfill is less than 1 w/mk, which is not able to meet the current flip chip application requirements such as 3D stacked multi-chips packaging. No matter which direction the heat will be dissipated through PCB or chip, the heat has to pass through the underfill in 3D stacked chips. Therefore the increase of thermal conductivity of underfill can significantly enhance the reliability of electronic devices, particularly in 3D package devices... |
You must be a registered user to talk back to us. |
Company Information:
More articles from YINCAE Advanced Materials, LLC. »
- Apr 05, 2018 - High Reliability and High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesives
- Oct 16, 2017 - High Reliability and High Temperature Application Solution - Solder Joint Encapsulant Paste
- Nov 17, 2016 - A High Thermal Conductive Solderable Adhesive
- Oct 03, 2016 - Room Temperature Fast Flow Reworkable Underfill For LGA
- Jan 12, 2016 - A Low Cost Manufacturing Solution - Low Temperature Super-Fast Cure and Flow Reworkable Underfill
- See all SMT / PCB technical articles from YINCAE Advanced Materials, LLC. »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
A Novel High Thermal Conductive Underfill For Flip Chip Appliation article has been viewed 488 times