Analysis of Inspection of DPA Test Requirements Applied To Flip Chip Technologies
Published: |
January 22, 2020 |
Author: |
Gonzalo Fernandez, Ana Collado |
Abstract: |
Flip chip assembly techniques bring a wide range of benefits:
But there is no dedicated inspection requirements nor DPA standard which address all the necessary aspects associated to this construction type or only cover partially the topics to be inspected.... |
|
Company Information:
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
Analysis of Inspection of DPA Test Requirements Applied To Flip Chip Technologies article has been viewed 399 times