A Study On Process, Strength And Microstructure Analysis Of Low Temperature SnBi Containing Solder Pastes Mixed With Lead-Free Solder Balls
Published: |
August 25, 2021 |
Author: |
Sakthi Cibi Kannammal Palaniappan and Martin.K.Anselm, Ph.D. |
Abstract: |
As the traditional eutectic SnPb solder alloy has been outlawed, the electronic industry has almost completely transitioned to the lead-free solder alloys. The conventional SAC305 solder alloy used in lead-free electronic assembly has a high melting and processing temperature with a typical peak reflow temperature of 245ºC which is almost 30ºC higher than traditional eutectic SnPb reflow profile. Some of the drawbacks of this high melting and processing temperatures are yield loss due to component warpage which has an impact on solder joint formation like bridging, open defects, head on pillow.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Rochester Institute of Technology »
- Nov 03, 2021 - Potential for Multi-Functional Additive Manufacturing Using Pulsed Photonic Sintering
- See all SMT / PCB technical articles from Rochester Institute of Technology »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
A Study On Process, Strength And Microstructure Analysis Of Low Temperature SnBi Containing Solder Pastes Mixed With Lead-Free Solder Balls article has been viewed 203 times