Tombstoning Of 0402 And 0201 Components: "A Study Examining The Effects Of Various Process And Design Parameters On Ultra-Small Passive Devices"
Published: |
September 1, 2021 |
Author: |
Michael Yuen, Heather Benedict, Kris Havlovitz, Tim Pitsch, Andy C. Mackie |
Abstract: |
The long-standing trend in the electronics industry has been the miniaturization of electronic components. It is projected that this trend will continue as Original Equipment Manufacturers (OEMs) and Electronic Manufacturing Service (EMS) providers strive to reduce "real estate" on printed circuit boards. Typically, the miniaturization of components can be achieved by integration or size reduction. At present, size reduction is considered to be more cost effective and flexible than integration. Passive components, which are used in limiting current, terminating transmission lines and de-coupling switching noise, are the primary focus in size reduction due to their variety of uses.... |
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