Additively Manufactured mm-Wave Multichip Modules With Fully Printed "Smart" Encapsulation Structures
Published: |
February 9, 2022 |
Author: |
Xuanke He, Bijan K. Tehrani, Ryan Bahr, Wenjing Su, and Manos M. Tentzeris |
Abstract: |
This article presents the first time that an millimeter-wave (mm-wave) multichip module (MCM) with on-demand "smart" encapsulation has been fabricated utilizing additive manufacturing technologies. RF and dc interconnects were fabricated using inkjet printing, while the encapsulation was realized using 3-D printing. Inkjet-printed interconnects feature superior RF performance, better mechanical reliability, and on-demand, low-cost fabrication process.... |
|
Company Information:
More articles from Georgia Institute of Technology »
- Aug 19, 2020 - All-in-One, Wireless, Stretchable Hybrid Electronics for Smart, Connected, and Ambulatory Physiological Monitoring
- Aug 13, 2020 - Additive Manufacturing for Next Generation Microwave Electronics and Antennas
- Jul 22, 2020 - Soft, Wireless Periocular Wearable Electronics For Real-Time Detection Of Eye Vergence In A Virtual Reality Toward Mobile Eye Therapies
- Jun 10, 2020 - Smart and Connected Bioelectronics for Seamless Health Monitoring and Persistent Human-Machine Interfaces
- Aug 10, 2017 - High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper - Metallized Through-Package-Vias (TPVs) in Ultra - thin Glass Interposers
- See all SMT / PCB technical articles from Georgia Institute of Technology »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
Additively Manufactured mm-Wave Multichip Modules With Fully Printed "Smart" Encapsulation Structures article has been viewed 160 times