Characterization of No Clean Solderpaste Residues: The Relationship to In-Circuit Testing
Published: |
May 7, 1999 |
Author: |
Merlin Kister, Kester Solder |
Abstract: |
Many manufacturers have now completed the conversion to no clean solder paste. Many factors governed this initial conversion, among those being cosmetics, solder ability, and process ability. In circuit testing or probing through no clean solder paste residues has topically not been a major factor in the conversion decision for several reasons. Due to board design, solder paste was only used on one side of the board and not subjected to testing...... |
|
|
|
|
|
|
You must be a Company Information:
- Jul 20, 2017 - Reactivity Of No-Clean Flux Residues Trapped Under Bottom Terminated Components
- May 17, 2017 - How to Use the Right Flux for the Selective Soldering Application
- Dec 29, 2016 - Partially-Activated Flux Residue Impacts on Electronic Assembly Reliabilities
- Oct 23, 2012 - Lead-free SMT Soldering Defects How to Prevent Them
- Feb 13, 2009 - SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control
- See all SMT / PCB technical articles from Kester »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
Characterization of No Clean Solderpaste Residues: The Relationship to In-Circuit Testing article has been viewed 446 times
