Electronics Manufacturing Technical Articles

Guangzhou Daheng Automation Equipment Co.,LTD

why need Under vaccum potting machine for motor stator iginition coil

Dec 31, 2021 | Fully Automatic Vacuum Chamber Glue Potting Solution

Publisher: Guangzhou Daheng Automation Equipment Co.,LTD

Whatsapp 0086 134 2516 4065 SMT glue dispenser machine, Meter mix dispenser, two component glue potting machine, mixi and dosing machine widely used PCB potting , led light encapsolution.

Guangzhou, China

Shenzhen Sewate Technology Co.,Ltd

What are the packaging forms of electronic components

Dec 31, 2021 | James Tong

The packaging method of surface mount components has become an important part of the SMT system. It directly affects the efficiency of assembly production and must be optimized in combination with the type and number of feeders of the SMT machine. There are four main types of packaging for surface mount components, Tape, tube, tray and bulk....

Publisher: Shenzhen Sewate Technology Co.,Ltd

Sewate professionally produce ESD protective packaging systems such as ic shipping tubes, plastic anti static ic tubes,, carrier tape, cover tape and reel, ESD trays for electronic components.

Shenzhen, China

Consultant / Service Provider, Manufacturer

How to Control Speed of Servo Motor & Anti-Interference Measures

Dec 31, 2021 | markee

A servomotor refers to the actuator to control the operation of mechanical components in the servo system and is a subsidy motor indirect transmission device. The servo motor can control speed, whose position accuracy is high, and convert voltage signal into torque and speed to drive the controlled object. A servomotor speed is controlled by the input signal, responding quickly....

OKmarts is an authorized and one-stop online mall for industrial parts covering refrigeration compressors, servo drives, servo motors, amplifiers, VFDs, HMIs, PLCs, encoders, sensors and more!

Hartford, Connecticut, USA

Czech Technical University in Prague

Effect of Thermal Aging on Solderabilityof ENEPIG Surface Finish Used in Printed Circuit Boards

Dec 29, 2021 | MaanBajnaid, Emily Holtzhouser, Jordan Terrell, Lawrence Yeh

Medtronic seeks to quantify the thermal aging limits of electroless Ni-electroless Pd-immersion Au (ENEPIG) surface finishes to determine how aggressive the silicon burn-in process can be without loss of solderability. Silicon burn-in (power testing at elevated temperature) is used to eliminate early field failures, critical for device reliability. Thermal aging due to burn-in or annealing causes Ni and Pd diffusion to and oxidation on the surface. Surface oxides limit wetting of the PbSn solder, affecting electrical connectivity of components soldered afterburn-in. Isothermal aging of two ENEPIG surface finishes was performed at 75°C-150°C for 100 hrs-1500hrs to test the thermal aging limits and identify how loss of solderability occurs....

Publisher: Purdue University

Purdue University

An educational institution, Purdue's ECET Department teaches ECAD design, electronic manufacturing, and electronic test including DFT.

West Lafayette, Indiana, USA

Investigation of Impacts on Printed Circuit Board Laminated Composites Caused by Surface Finish Application

Dec 29, 2021 | Denis Froš , Karel Dušek and Petr Veselý

The purpose of this study was to compare the strength of the bond between resin and glass cloth for various composites (laminates) and its dependence on utilized soldering pad surface finishes. Moreover, the impact of surface finish application on the thermomechanical properties of the composites was evaluated. Three different laminates with various thermal endurances were included in the study. Soldering pads were covered with OSP and HASL surface finishes. The strength of the cohesion of the resin upper layer was examined utilizing a newly established method designed for pulling tests....

Publisher: Czech Technical University in Prague

The Czech Technical University in Prague (CTU) is one of the largest and oldest technical universities in Europe. According to Methodology 2017+, CTU occupies first place in the rankings for technical universities in the Czech Rep

Prague 6, Czech Republic

How to Communicate PLC to VFD

Dec 28, 2021 | markee

PLC (Programmable Logic Controller) and VFD (Variable Frequency Drive) play an important role in industrial production and technological development. They have been widely used in the field of industrial automation and mechanical automation. The control of the PLC and VFD is quite intelligent and automated, which brings great convenience to industrial production and life. The PLC and VFD will perform intelligent calculation, control and output according to the predetermined program. Today we will focus on how the PLC and the VFD communicate, and in what ways? First, let's take a look at their respective basic structures....

OKmarts is an authorized and one-stop online mall for industrial parts covering refrigeration compressors, servo drives, servo motors, amplifiers, VFDs, HMIs, PLCs, encoders, sensors and more!

Hartford, Connecticut, USA

Oncology Information System Market Is Expected To Register a Notable CAGR of ~7%

Dec 27, 2021 | Ataurrahaman

Research Nester published a report titled "Oncology Information System Market: Global Demand Analysis & Opportunity Outlook 2030" which delivers a detailed overview of the global oncology information system market in terms of market segmentation by product, software, end-user, and by region....

Publisher: Research Nester

Research Nester

Research Nester is a one-stop service provider, leading in strategic market research and consulting with an unbiased and unparalleled approach towards helping global industrial players.

New York, New York, USA

List of Problems and Solutions for Centrifugal Air Compressor

Dec 22, 2021 | markee

As a speed type air compressor, centrifugal compressor can generate air flow moving in radial direction. Centrifugal air compressors are used by a large number of companies today because of their high-pressure tightness. Therefore, common faults in the operation have become one of the most concerned issues for users. This article will discuss causes of centrifugal compressor failures and give corresponding maintenance measures. At the end, OKmarts has listed the problems and solutions in detail for your quick reference....

OKmarts is an authorized and one-stop online mall for industrial parts covering refrigeration compressors, servo drives, servo motors, amplifiers, VFDs, HMIs, PLCs, encoders, sensors and more!

Hartford, Connecticut, USA

Würth Elektronik GmbH & Co. KG

HDI Microvia Technology – Cost Aspects

Dec 21, 2021 | Stefan Keller

Points of discussion in "HDI Microvia Technology – Cost Aspects" are: - Reasons for the use of HDI technology - Printed circuit board (PCB) size - Number of layers - Stack-up and complexity - Other important cost influences -–Design rules -–Drilling costs -–Microvia filling...

Publisher: Würth Elektronik GmbH & Co. KG

We produce circuit boards from your specifications in various designs.

Niedernhall, Germany

Consultant / Service Provider, Manufacturer

Thermal Reliability of Laser Ablated Microvias and Standard Through-Hole Technologies as a Function of Materials and Processing

Dec 21, 2021 | Todd Young, Frank Polakovic and Michael Carano

High Density Interconnect (HDI) technologies are being used widely in Asia and Europe in consumer electronics for portable wireless communication and computing, digital imaging, and chip packaging. Although North America lags behind in developing process capability for this technology, HDI will become a significant business segment for North America. For this to happen, the printed circuit board shops will have to become process capable in fabricating fine lines and spaces, and also be capable in forming and plating microvias....

Publisher: Isola Group

Isola Group

Isola a global material sciences company focused on designing, developing, manufacturing and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multilayer PCBs.

Chandler, Arizona, USA

CALCE Center for Advanced Life Cycle Engineering

Using Simulation to Optimize Microvia Placement and Materials to Avoid Failure During Reflow

Dec 21, 2021 | Dr. Kourosh Kalayeh, Dr. Nathan Blattau

This paper cover the following points: - Objective 01: Preprocessing, - Introduction, - Objective 02: Automated FE Scripting, - Objective 03: Postprocessing, Reliability Analysis of PTHs, - Objective 03: Postprocessing, Manufacturability of Microvias...

Publisher: CALCE Center for Advanced Life Cycle Engineering

The largest electronic products research center focused on electronics reliability, is dedicated to providing a knowledge and resource base to support the development of competitive electronic components, products and systems.

College Park, Maryland, USA

Consultant / Service Provider, Training Provider

Reliability of PWB Microvias for High Density Package Assembly

Dec 21, 2021 | Reza Ghaffarian, Ph.D.

High density PWB (printed wiring board) with microvia technology is required for implementation of high density and high I/O area array packages (AAP). COTS (commercial off-the-shelf) AAP packaging technologies in high reliability versions with 1.27 mm pitch are now being considered for use in a number of NASA systems including the Space Shuttle and Mars Rovers. NASA functional system designs are requiring ever more denser AAP packages and board features, making board microvia technology very attractive for effectively routing a large number of package inputs/outputs....

Publisher: NASA Office Of Safety And Mission Assurance

NASA Office Of Safety And Mission Assurance

The Office of Safety and Mission Assurance (OSMA) assures the safety and enhances the success of all NASA activities through the development, implementation and oversight of agencywide safety, reliability, maintainability and ...

Washington, District of Columbia, USA

Global Building Automation Systems Market Is Estimated To Occupy a Large Amount Of Revenue By Recording a CAGR of ~11%

Dec 20, 2021 | Ataurrahaman

The global building automation systems market is estimated to occupy a large amount of revenue by recording a CAGR of ~11% during the forecast period, i.e., 2022–2030, owing to the growing need for proper energy management across the globe, and increasing emphasis on overcoming utility costs....

Publisher: Research Nester

Research Nester

Research Nester is a one-stop service provider, leading in strategic market research and consulting with an unbiased and unparalleled approach towards helping global industrial players.

New York, New York, USA

Global Recycled Plastics Market Is Growing With a CAGR of 4.5%

Dec 20, 2021 | Ataurrahaman

Research Nester, in its repository of market research reports, has added a report on the topic "Global Recycled Plastics Market", which is studied for the forecast period, i.e., 2021-2028. The report includes a brief analysis of the key players operating in the market, along with their latest developments. The report also focuses on the latest market trends, along with the opportunities and the drivers that are expected to drive the market growth during the forecast period....

Publisher: Research Nester

Research Nester

Research Nester is a one-stop service provider, leading in strategic market research and consulting with an unbiased and unparalleled approach towards helping global industrial players.

New York, New York, USA

Troubleshooting of Diffusion Silicon Pressure Transmitter

Dec 17, 2021 | markee

Diffusion silicon pressure transmitter is applied in a wide variety of industries, such as petroleum, chemical industry, steel, power, light industry and environmental protection industry. It can complete the work of measurement and control of the gauge pressure, negative pressure or absolute pressure of various fluid pressure. Most importantly, this type of transmitter can be used in corrosive medium and harsh or dangerous environment. In the process of using the transmitter, there may be some faults or problems....

OKmarts is an authorized and one-stop online mall for industrial parts covering refrigeration compressors, servo drives, servo motors, amplifiers, VFDs, HMIs, PLCs, encoders, sensors and more!

Hartford, Connecticut, USA

CALCE Center for Advanced Life Cycle Engineering

Reliability Evaluation of One-Pass and Two-Pass Techniques of Assembly for Package on Packages under Torsion Loads

Dec 16, 2021 | Vikram Srinivas, Michael Osterman, Robert Farrell

Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the greatest benefits of PoP technology is the elimination of the expensive and challenging task of routing high-speed memory lines from under the processor chip out to memory chip in separate packages. Instead, the memory sits on top of the processor and the connections are automatically made during assembly. For this reason PoP technology has gained wide acceptance in cell phones and other mobile applications. PoP technology can be assembled using one-pass and two-pass assembly processes. In the one-pass technique the processor is first mounted to the board, the memory is mounted to the processor and the finished board is then run through the reflow oven in a single pass. The two-pass technique has an intermediate step in which the memory is first mounted onto the processor....

Publisher: CALCE Center for Advanced Life Cycle Engineering

College Park, Maryland, USA

Consultant / Service Provider, Training Provider

Package-on-Package (PoP) Warpage Characteristic and Requirement

Dec 16, 2021 | Wei Keat Loh, Ron Kulterman, Tim Purdie, Haley Fu, Masahiro Tsuriya

Package-on-Package (PoP) technology is widely used in mobile devices due to its simple design, lower cost and faster time to market. Warpage characteristic and requirement of PoP package becomes critical to ensure both the top and bottom package can be mounted with minimal yield lost. With this challenge in placed, iNEMI has been working relentlessly to fingerprint the current PoP package technology warpage characteristic and to establish some key learning for packaging technologies. The work also extended to understand the basic requirement needed for successful PoP stacking by analyzing the warpage data obtained and formulate a simple analytical equation to explain the true warpage requirement for PoP packaging....

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Samsung Electro-Mechanics

Package-on-Package (PoP) for Advanced PCB Manufacturing Process

Dec 16, 2021 | Joseph Y. Lee, Jinyong Ahn, JeGwang Yoo, and Shuichi Okabe

In the 1990's, both BGA (Ball Grid Array) and CSP (Chip Size Package) are entering their end in the front-end packaging materials and process technology. Both BGA and CSP like SMD (Surface Mount Device) from the I 980's and THD (Through-Hole mount Device) from the 1970's are reaching its own impasse in terms of maximizing its electrical, mechanical, and thermal performances, size, weight, and reliability....

Publisher: Samsung Electro-Mechanics

Samsung Electro-Mechanics produces high-tech integrated components of electronics and mechanical devices for all electrical devices.

SUWON, South Korea

Marketing Agency

The Challenges Of Package On Package (Pop) Devices During Assembly And Inspection

Dec 16, 2021 | Bob Willis, David Bernard

Ball Grid Array devices, BGAs, are widely used in a vast range of products including consumer, telecommunications and office based systems. As an area array device of solder joints, it provides high packing density with a relatively easy introduction cycle. However, over the last couple of years engineers have started to experiment, and in some cases implement, stacked packages, of the type often called Package on Package, or POP. In simple terms, POP devices are the stacking of components, one on top of the other, either during the original component manufacture or during printed board assembly....

Publisher: Electronic Presentation Services

A Quick Look at HMI Touch Screen in Industrial Scenes

Dec 08, 2021 | markee

In modern society, mobile phone is almost a necessity for everyone. When your mobile phone is not around, you may easily feel anxious as if something is missing, which is called nomophobia. In the past, people used to check if they had taken money when they went out. But now, mobile phone is the thing people must take. As is known to us, as long as you take a mobile phone, it's easy to get food, clothes, and to take transport. Look at our mobile phones, you will find almost all of them are equipped with touch screens now, which are much better than the early keyboard for using. So, how much do you know about HMI touch screens in industrial scenes?...

OKmarts is an authorized and one-stop online mall for industrial parts covering refrigeration compressors, servo drives, servo motors, amplifiers, VFDs, HMIs, PLCs, encoders, sensors and more!

Hartford, Connecticut, USA

Basics of Encoder and Orthogonal Coding

Dec 07, 2021 | markee

Encoder is a kind of electromechanical equipment, which can be used to measure the movement of machinery or the target position of machinery. Most encoders use optical sensors to provide electrical signals in the form of pulse sequences, which can be converted into motion, direction or position information in turn....

OKmarts is an authorized and one-stop online mall for industrial parts covering refrigeration compressors, servo drives, servo motors, amplifiers, VFDs, HMIs, PLCs, encoders, sensors and more!

Hartford, Connecticut, USA

Guangzhou Daheng Automation Equipment Co.,LTD

Fully Automatic Vacuum Chamber Glue Potting Solution

Dec 06, 2021 | Fully Automatic Vacuum Chamber Glue Potting Solution

By potting under vacuum, components can be optimally protected from external influences. Before the potting process, air and moisture are removed from the components by vacuum. Components with geometries that are difficult to vent, coils, transformers or wound goods can be potting free of air bubbles. Potting under vacuum guarantees an even distribution of the potting material.Whatsapp 0086 134 2516 4065...

Publisher: Guangzhou Daheng Automation Equipment Co.,LTD

Whatsapp 0086 134 2516 4065 SMT glue dispenser machine, Meter mix dispenser, two component glue potting machine, mixi and dosing machine widely used PCB potting , led light encapsolution.

Guangzhou, China

Photoelectric Encoder on CNC Machines Troubleshooting and Solutions

Dec 03, 2021 | markee

CNC machines is the abbreviation of "Computer Numerical Control" machines. It is an automatic machine tool with program control system. The control system can logically process the programs with control codes or other symbolic instructions, decode them and express them with coded numbers. Next, the coded numbers will be input into the numerical control device through the information carrier. After calculation and processing, the numerical control device sends out various control signals to control the action of the machine tool. CNC machine can automatically produce parts or other products according to the shape and size specified by the drawings....

OKmarts is an authorized and one-stop online mall for industrial parts covering refrigeration compressors, servo drives, servo motors, amplifiers, VFDs, HMIs, PLCs, encoders, sensors and more!

Hartford, Connecticut, USA

Calibration of Rosemount Transmitter

Dec 03, 2021 | markee

When adjusting the transmitter, please turn off the protection setting, which is usually the red switch in front of the meter and its status may be ON or OFF. If it is ON, you will not be able to make the calibration adjustment....

OKmarts is an authorized and one-stop online mall for industrial parts covering refrigeration compressors, servo drives, servo motors, amplifiers, VFDs, HMIs, PLCs, encoders, sensors and more!

Hartford, Connecticut, USA

Big Data as a Promoter of Industry 4.0: Lessons of the Semiconductor Industry

Dec 02, 2021 | David Cemernek; Heimo Gursch; Roman Kern

The catchphrase "Industry 4.0" is widely regarded as a methodology for succeeding in modern manufacturing. This paper provides an overview of the history, technologies and concepts of Industry 4.0. One of the biggest challenges to implementing the Industry 4.0 paradigms in manufacturing are the heterogeneity of system landscapes and integrating data from various sources, such as different suppliers and different data formats. These issues have been addressed in the semiconductor industry since the early 1980s and some solutions have become well-established standards. Hence...

Publisher: Know-Center GmbH

Know-Center GmbH

Know-Center GmbH Research Center for Data-Driven Business & Big Data Analytics is located in Graz, Steiermark, Austria and is part of the Scientific Research and Development Services Industry.

Steiermark, Austria

University of Information Technologies, Mechanics and Optics [ITMO University]

From Industry 3.0 To Industry 4.0: Production Modernization And Creation Of Innovative Digital Companies

Dec 02, 2021 | D A Zakoldaev, A V Shukalov and I O Zharinov

Some mechanical and assembly productions of existing companies of the Industry 3.0 and mechanical and assembly productions of perspective companies of the Industry 4.0 are described. The basic components of a smart factory and their interconnection to organize a production activity using humanless and paperless technologies are defined. A comparison analysis of parts and blanks movement to complete route sheet of the item manufacturing (radio and electronic item designing) in the companies of the Industry 3.0 and Industry 4.0 is given. The components of a digital item designing company to be created and implemented in the industry at first hand are defined....

Publisher: University of Information Technologies, Mechanics and Optics [ITMO University]

ITMO University is St. Petersburg's best university and one of the top universities in the world. With over 120 years of experience propelling it forward, ITMO is a trailblazer in all things IT, quantum science, and photonics.

St Petersburg, Russia

Fraunhofer Institute for Applied Information Technology

Industry 4.0: Mining Physical Defects in Production of Surface-Mount Devices

Dec 02, 2021 | Farshid Tavakolizadeh, José Ángel Carvajal Soto, Dávid Gyulai and Christian Beecks

With the advent of Industry 4.0, production processes have been endowed with intelligent cyber-physical systems generating massive amounts of streaming sensor data. Internet of Things technologies have enabled capturing, managing, and processing production data at a large scale in order to utilize this data as an asset for the optimization of production processes. In this work, we focus on the automatic detection of physical defects in the production of surfacemount devices. We show how to build a classification model based on random forests that efficiently detects defect products with a high degree of precision. In fact, the results of our preliminary experimental analysis indicate that our approach is able to correctly determine defects in a simulated production environment of surface-mount devices with a MCC score of 0.96. We investigate the feasibility of utilizing this approach in realistic settings. We believe that our approach will help to advance the production of surface-mount devices....

Publisher: Fraunhofer Institute for Applied Information Technology

As a partner for digitization, Industry 4.0 and the Internet of Things, the Fraunhofer Institute for Applied Information Technology FIT has been developing IT solutions tailored to people and seamlessly integrated into business

Sankt Augustin, Germany

Basics of ASHCROFT Pressure Transmitter - Performance Index, Wiring, Thread Type, Unavoidable Inaccuracies and Mounting

Nov 29, 2021 | markee

ASHCROFT pressure transmitter is one of the most commonly used transmitters in industrial applications. It is widely used in a variety of control environments, involving water conservancy and hydropower, railway transportation, intelligent building, production automation, aerospace, military, petrochemical, oil wells, electric power, ships, machine tools and pipelines. ASHCROFT pressure transmitter is an electronic device that senses the pressure signal and converts it into an available output electrical signal according to certain rules....

OKmarts is an authorized and one-stop online mall for industrial parts covering refrigeration compressors, servo drives, servo motors, amplifiers, VFDs, HMIs, PLCs, encoders, sensors and more!

Hartford, Connecticut, USA

An Investigation into Alternative Methods of Drying Moisture Sensitive Devices

Nov 26, 2021 | Vinny Nyugen

The use of desiccant bags filled with Silica Sand and or Clay beads used in conjunction with a Moisture Barrier Bag to control moisture for storage of printed circuit boards has long been an accepted practice and standard from both JEDEC and IPC organizations. Additionally, the use heated ovens for baking off moisture using the evaporation process has also been a longstanding practice from these organizations. This paper on alternative drying methods will be accompanied by completed independent, unbiased tests conducted by Vinny Nguyen, an engineering student (now graduated) from San Jose State University. The accompanied paper will examine the performance levels of different technologies of desiccant bags to control moisture in enclosed spaces. The tests and equipment set were reviewed by an engineer and consultant to the Lockheed Martin Aerospace Division and the IPC - TM-650 2.6.28 test method was review by engineer from pSemi. The tests were designed to mimic performance tests outlined in Mil Spec 3464, which both IPC and JEDEC have adopted for their respective standards. The test examined variables including absorption capacity rates, weight gain and release of moisture back into the enclosed area. The presentation will also address and highlight: • Similarities of PCBs and Heavy Equipment as it applies to Inspections, Causes of Failure, Types of Corrosion and Moisture Collection Points. • Performance Attributes of Different Desiccant Technologies as it applies to shape, texture, change outs, labeling and regeneration. • Venn Diagram of Electromechanical Failure with the circles 1. Current 2. Contamination 3. Humidity Presentation Available...

Publisher: Steel Camel

Steel Camel

Super powerful expanding desiccant to keep boards & microelectronics moisture free.... Much different than Silica Sand Beads. Also supplier of corrosion prevention treatments that are alternatives to Conformal coatings.

Tampa, Florida, USA

Other

Basics of Industrial Control System and the Use of PLC

Nov 26, 2021 | markee

The components of industrial control system (ICS) can be roughly divided into two categories according to their location: control center equipment and remote site equipment....

OKmarts is an authorized and one-stop online mall for industrial parts covering refrigeration compressors, servo drives, servo motors, amplifiers, VFDs, HMIs, PLCs, encoders, sensors and more!

Hartford, Connecticut, USA

Different Types of Pressure Transmitters, Working Principle, and How to Select Pressure Transmitter

Nov 25, 2021 | markee

Pressure transmitter is a kind of pressure measuring instrument widely used in many transmitters. It is widely used in petroleum, chemical, metallurgy, food, electric power, medicine, papermaking, textile and other industries. It is mainly used to detect the differential pressure, pressure, absolute pressure and liquid level of fluid....

OKmarts is an authorized and one-stop online mall for industrial parts covering refrigeration compressors, servo drives, servo motors, amplifiers, VFDs, HMIs, PLCs, encoders, sensors and more!

Hartford, Connecticut, USA

Automated Optical Inspection Method for Light-Emitting Diode Defect Detection Using Unsupervised Generative Adversarial Neural Network

Nov 22, 2021 | Che-Hsuan Huang, Pei-Hsuan Lee, Shu-Hsiu Chang, Hao-Chung Kuo, Chia-Wei Sun, Chien-Chung Lin, Chun-Lin Tsai and Xinke Liu

Many automated optical inspection (AOI) companies use supervised object detection networks to inspect items, a technique which expends tremendous time and energy to mark defectives. Therefore, we propose an AOI system which uses an unsupervised learning network as the base algorithm to simultaneously generate anomaly alerts and reduce labeling costs. This AOI system works by deploying the GANomaly neural network and the supervised network to the manufacturing system. To improve the ability to distinguish anomaly items from normal items in industry and enhance the overall performance of the manufacturing process, the system uses the structural similarity index (SSIM) as part of the loss function as well as the scoring parameters. Thus, the proposed system will achieve the requirements of smart factories in the future (Industry 4.0)....

Publisher: Shenzhen University

Shenzhen University

Shenzhen University is a public research university located in Nanshan district, Shenzhen, Guangdong, China. It is accredited by the State Council of the People's Republic of China and is funded by the Shenzhen City Government.

Shenzhen, Guangdong Province, China

Streaming Machine Learning and Online Active Learning for Automated Visual Inspection

Nov 22, 2021 | Jože M. Rožanec, Elena Trajkova, Paulien Dam, Blaž Fortuna, Dunja Mladenić

Quality control is a key activity performed by manufacturing companies to verify product conformance to the requirements and specifications. Standardized quality control ensures that all the products are evaluated under the same criteria. The decreased cost of sensors and connectivity enabled an increasing digitalization of manufacturing and provided greater data availability. Such data availability has spurred the development of artificial intelligence models, which allow higher degrees of automation and reduced bias when inspecting the products. Furthermore, the increased speed of inspection reduces overall costs and time required for defect inspection. In this research, we compare five streaming machine learning algorithms applied to visual defect inspection with real world data provided by Philips Consumer Lifestyle BV. Furthermore, we compare them in a streaming active learning context, which reduces the data labeling effort in a real-world context. Our results show that active learning reduces the data labeling effort by almost 15% on average for the worst case, while keeping an acceptable classification performance. The use of machine learning models for automated visual inspection are expected to speed up the quality inspection up to 40%....

Publisher: Jožef Stefan Institute

Jožef Stefan Institute

The Jožef Stefan Institute is the largest research institute in Slovenia. The main research areas are physics, chemistry, molecular biology, biotechnology, information technologies, reactor physics, energy and environment. ...

Ljubljana, Slovenia

Vienna University of Technology [TU Wien]

An Automatic Optical Inspection System for the Diagnosis of Printed Circuits Based on Neural Networks

Nov 22, 2021 | Ahmed Nabil Belbachir, Mario Lera, Alessandra Fanni, Augusto Montisci

The aim of this work is to define a procedure to develop diagnostic systems for Printed Circuit Boards, based on Automated Optical Inspection with low cost and easy adaptability to different features. A complete system to detect mounting defects in the circuits is presented in this paper. A low cost image acquisition system with high accuracy has been designed to fit this application. Afterward, the resulting images are processed using the Wavelet Transform and Neural Networks, for low computational cost and acceptable precision. The wavelet space represents a compact support for efficient feature extraction with the localization property. The proposed solution is demonstrated on several defects in different kind of circuits....

Publisher: Vienna University of Technology [TU Wien]

TU Wien is one of the major universities in Vienna, Austria. The university finds high international and domestic recognition in teaching as well as in research and is a highly esteemed partner of innovation-oriented enterprise.

Vienna, Austria

Speedline Technologies, Inc.

Effect of Nano-Coated Stencil on 01005 Printing

Nov 17, 2021 | Rita Mohanty Ph.D., S. Manian Ramkumar Ph.D., Chris Anglin, Toshitake Oda

The demand for product miniaturization, especially in the handheld device area, continues to challenge the board assembly industry. The desire to incorporate more functionality while making the product smaller continues to push board design to its limit. It is not uncommon to find boards with castle-like components right next to miniature components. This type of board poses a special challenge to the board assemblers as it requires a wide range of paste volume to satisfy both small and large components. One way to address the printing challenge is to use creative stencil design to meet the solder paste requirement for both large and small components. ... The most important attribute of a stencil is its release characteristic. In other words, how well the paste releases from the aperture. The paste release, in turn, depends on the surface characteristics of the aperture wall and stencil foil. The recent introduction of new technology, nano-coating for both stencil and squeegee blades, has drawn the attention of many researchers. As the name implies, nano-coated stencils and blades are made by a conventional method such as laser-cut or electroformed then coated with nano-functional material to alter the surface characteristics. This study will evaluate nano-coated stencils for passive component printing, including 01005....

Publisher: Speedline Technologies, Inc.

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, USA

Shenzhen PTI Technology CO.,LTD

SMT Stencil Cleaning: A Decision That Could Impact Production

Nov 16, 2021 | Richard S. Clouthier

Ultrasonics, coupled with an aqueous detergent process that cleans at below 43ºC, may be best suited for fine-pitch SMT screens and stencils. Aqueous detergents clean more effectively than solvents, with little or no environmental impact. Because of the environmental concerns driving today's technology decisions, the once simple decision of selecting a stencil cleaning process is now clouded with different chemicals, different cleaning machines and various types of solder paste, all with specific environmental, health and safety related issues and regulations....

Publisher: Xerox

Xerox

manufacture of photocopiers

Dundalk, Ireland

Operation about MIC audio test

Nov 15, 2021 | pti

The audio comprehensive tester can test consumer audio, automotive electronics and other audio products, such as mobile phones, headphones, speakers, players, power amplifiers, home cinemas, televisions, set-top boxes, automotive multimedia hosts, etc. It is suitable for rapid testing of production line and R & D testing. It can realize fast audio, simple and convenient operation, and support automatic testing. Support analog / digital input and analog output, up to 192K digital sampling rate, and multiple test functions, including audio output, signal acquisition, audio file analysis, etc....

Publisher: Shenzhen PTI Technology CO.,LTD

Our company was established in 2004, Main products: ICT on-line tester, ICT, functional testing machine 、FCT、 TSI、 automatic test and control system (ATE), test automation solutions, etc.

深圳, China

Stencil Cleaning - A Practical Approach To Improving Yields And Maximizing Your Throughput

Nov 10, 2021 | Debbie Carboni

Main Points * Technologies for the job * More than a flat piece of Stainless * Compatibility * Solubility in stencil cleaning * Influencing factors * Best Practices to reduce misprints and increase yields...

Publisher: KYZEN Corporation

KYZEN Corporation

A leading supplier of precision cleaning chemistries to the worldwide electronics, metal finishing, medical, semiconductor, and optical industries.

Nashville, Tennessee, USA

Understanding the Cleaning Process for Automatic Stencil Printers

Nov 10, 2021 | Ed Nauss

The automatic stencil wiper - first line of defense * The Printing process and why we need to focus on the wiping function * Frequency of wiping * Wiping options * Wiper profiles • Event driven wiping * Advanced options * Materials – Paper * Materials – Solvent * Preventive maintenance * Random stuff...

Publisher: ITW EAE

ITW EAE

ITW EAE is a manufacturer of equipment used in the electronic assembly and semiconductor industries. The group brings together world-class products from Camalot, Despatch, Electrovert, MPM, and Vitronics Soltec.

Lakeville, Minnesota, USA

Where will Computer Numerical Control Machines Go

Nov 04, 2021 | markee

At present, the development of Computer Numerical Control (CNC) machines with each passing day, characteristics of high-speed, high-precision, complex, intelligent, open, parallel drive, network, extreme, green have become the trend and direction....

OKmarts is an authorized and one-stop online mall for industrial parts covering refrigeration compressors, servo drives, servo motors, amplifiers, VFDs, HMIs, PLCs, encoders, sensors and more!

Hartford, Connecticut, USA

Fabrication Of Solderable Intense Pulsed Light Sintered Hybrid Copper For Flexible Conductive Electrodes

Nov 03, 2021 | Yong‑Rae Jang, Robin Jeong, Hak‑Sung Kim & Simon S. Park

Additively printed circuits provide advantages in reduced waste, rapid prototyping, and versatile flexible substrate choices relative to conventional circuit printing. Copper (Cu) based inks along with intense pulsed light (IPL) sintering can be used in additive circuit printing. However, IPL sintered Cu typically suffer from poor solderability due to high roughness and porosity. To address this, hybrid Cu ink which consists of Cu precursor/nanoparticle was formulated to seed Cu species and fill voids in the sintered structure. Nickel (Ni) electroplating was utilized to further improve surface solderability. Simulations were performed at various electroplating conditions and Cu cathode surface roughness using the multi-physics finite element method. By utilizing a mask during IPL sintering, conductivity was induced in exposed regions; this was utilized to achieve selective Ni-electroplating. Surface morphology and cross section analysis of the electrodes were observed through scanning electron microscopy and a 3D optical profilometer. Energy dispersive X-ray spectroscopy analysis was conducted to investigate changes in surface compositions. ASTM D3359 adhesion testing was performed to examine the adhesion between the electrode and substrate. Solder-electrode shear tests were investigated with a tensile tester to observe the shear strength between solder and electrodes. By utilizing Cu precursors and novel multifaceted approach of IPL sintering, a robust and solderable Ni electroplated conductive Cu printed electrode was achieved....

Publisher: Hanyang University

Hanyang University

Hanyang University is a private research university in South Korea. The main campus is located in Seoul and its satellite campus, the Education Research Industry Cluster, is in Ansan.

Seoul, South Korea

Rochester Institute of Technology

Potential for Multi-Functional Additive Manufacturing Using Pulsed Photonic Sintering

Nov 03, 2021 | Sourav Das, Denis Cormier, and Scott Williams

This paper proposes the integration of pulsed photonic sintering into multi-material additive manufacturing processes in order to produce multifunctional components that would be nearly impossible to produce any other way. Pulsed photonic curing uses high power Xenon flash lamps to thermally fuse printed nanomaterials such as conductive metal inks. To determine the feasibility of the proposed integration, three different polymer additive manufacturing materials were exposed to typical flash curing conditions using a Novacentrix Pulseforge 3300 system. FTIR analysis revealed virtually no change in the polymer substrates, thus indicating that the curing energy did not damage the polymer. Next, copper traces were printed on the same substrate, dried, and photonically cured to establish the feasibility of thermally fusing copper metal on the polymer additive manufacturing substrates. Although drying defects were observed, electrical resistivity values ranging from 0.081 to 0.103 Ω/sq. indicated that high temperature and easily oxidized metals can be successfully printed and cured on several commonly used polymer additive manufacturing materials. These results indicate that pulsed photonic curing holds tremendous promise as an enabling technology for next generation multimaterial additive manufacturing processes....

Publisher: Rochester Institute of Technology

Rochester Institute of Technology is a private research university in the town of Henrietta in the Rochester, New York metropolitan area. The university offers undergraduate and graduate degrees, including doctoral and professiona

Rochester, New York, USA

Photonic Flash Soldering on Flex Foils for Flexible Electronic Systems

Nov 03, 2021 | Gari Arutinov, Jeroen van den Brand, Rob Hendriks

Ultrathin bare die chips were soldered using a novel soldering technology. Using homogeneous flash light generated by high-power xenon flash lamp the dummy components and the bare die NFC chips were successfully soldered to copper tracks on polyimide (PI) and polyethylene terephthalate (PET) flex foils by using industry standard Sn-Ag-Cu lead free alloys. Due to the selectivity of light absorption, a limited temperature increase was observed in the PET substrates while the chip and copper tracks were rapidly heated to a temperatures above the solder melting temperature. This allowed to successfully soldered components onto the delicate polyethylene foil substrates using lead-free alloys with liquidus temperatures above 200 °C. It was shown that by preheating components above the decomposition temperature of solder paste flux with a set of short low intensity pulses the processing window could be significantly extended compared to the process with direct illumination of chips with high intensity flash pulse. Furthermore, it was demonstrated that with localized tuning of pulse intensity components having different heat capacity could be simultaneously soldered using a single flash pulse....

Publisher: NovaCentrix

NovaCentrix

With decades of combined experience, our science and engineering leadership team is dedicated to creating industry-changing technologies, including our PulseForge® tools and Metalon® conductive inks.

Austin, Texas, USA

Huazhong University of Science and Technology

Reflow Soldering Method With Gradient Energy Band Generated By Optical System

Nov 03, 2021 | Yongqian Chen, Guangzhi Zhu,* Yebo Zhou, Mu Wang, Xianshi Jia, and Xiao Zhu

Laser reflow soldering is an important technology in electronic components processing. In this paper, we presented a simple but efficient method to achieve reflow soldering process with gradient energy band created by just two parallel mirrors. The detailed influence of the variety of optical parameters on the soldering process has been analyzed by using the finite element method. And the modulation of the optical parameters on reflow soldering parameters also has been demonstrated. In our experiment, one HR mirror and one-mirror with transmissivity of 10% have been used to create a gradient energy band with an incident laser power of 50W. In summary, both the simulations and the experiments show that the typical reflow soldering profile has been acquired by the optical system. The high quality joints on both the front and rear surface of the capacitor can be acquired by just one surface radiation of the optical system....

Publisher: Huazhong University of Science and Technology

Huazhong University of Science and Technology is a public research university located in Guanshan Subdistrict, Hongshan District, Wuhan, Hubei province, China. As a national key university directly affiliated to the Ministry of ..

Wuhan, Hubei, China

How to Test a Mass Flow Sensor?

Oct 27, 2021 | markee

The mass flow sensor, or air flow sensor is one of the important sensors of the electronic fuel injection engine. It is installed between the air filter and the intake hose to measure the intake volume of the engine cylinder and adjust the fuel ratio according to it. The mass flow sensor converts the inhaled air flow into electrical signals and sends them to the electronic control unit (ECU). As one of the basic signals to determine the fuel injection, it is a sensor that measures the air flow of the suction engine. So if you want to test it, how should you do? Let's start it....

OKmarts is an authorized and one-stop online mall for industrial parts covering refrigeration compressors, servo drives, servo motors, amplifiers, VFDs, HMIs, PLCs, encoders, sensors and more!

Hartford, Connecticut, USA

Foundry Research Institute

Effects of PCB Substrate Surface Finish and Flux on Solderability of Lead-Free SAC305 Alloy

Oct 20, 2021 | A. Siewiorek, A. Kudyba, N. Sobczak, M. Homa, Z. Huber, Z. Adamek, and J. Wojewoda-Budka

The solderability of the SAC305 alloy in contact with printed circuit boards (PCB) having different surface finishes was examined using the wetting balance method. The study was performed at a temperature of 260 _C on three types of PCBs covered with (1) hot air solder leveling (HASL LF), (2) electroless nickel immersion gold (ENIG), and (3) organic surface protectant (OSP), organic finish, all on Cu substrates and two types of fluxes (EF2202 and RF800). The results showed that the PCB substrate surface finish has a strong effect on the value of both the wetting time t0 and the contact angle h. The shortest wetting time was noted for the OSP finish (t0 = 0.6 s with EF2202 flux and t0 = 0.98 s with RF800 flux), while the ENIG finish showed the longest wetting time (t0 = 1.36 s with EF2202 flux and t0 = 1.55 s with RF800 flux). The h values calculated from the wetting balance tests were as follows: the lowest h of 45_ was formed on HASL LF (EF2202 flux), the highest h of 63_ was noted on the OSP finish, while on the ENIG finish, it was 58_ (EF2202 flux). After the solderability tests, the interface characterization of cross-sectional samples was performed by means of scanning electron microscopy coupled with energy dispersive spectroscopy....

Publisher: Foundry Research Institute

Łukasiewicz - Kraków Institute of Technology was established on April 1, 2020 as a result of the merger of two Kraków institutes that are part of the Łukasiewicz Research Network.

Cracow, Poland

Consultant / Service Provider, Manufacturer, Training Provider

PCB Surface Finishes & The Cleaning Process - A Compatibility Study

Oct 20, 2021 | Umut Tosun, Naveen Ravindran

All PCBs that are manufactured require a surface finish to protect exposed copper on the surface which if left unprotected, can oxidize, rendering the board unusable. To address this issue, it is common to surface treat the PCB prior to assembly and reflow. The surface finish not only prevents oxidation of the underlying copper, but guarantees a solderable surface. A cost effective and widely used approach to PCB surface finish is HASL (Hot Air Solder Leveling). However, as circuit complexity and component density have increased, HASL has reached its limitations, necessitating the need for thinner coatings. Thus, coatings such as Immersion Tin (ImSn), Immersion Silver (ImAg), Organic Solderability Preservatives (OSP), and Electroless Nickel Immersion Gold (ENIG) are becoming more widely used....

Publisher: ZESTRON Americas

ZESTRON Americas

The globally leading provider of high precision cleaning products, services and training solutions in the electronics and semiconductor manufacturing industries.

Manassas,

Counterfeit Detection Strategies: When to Do It / How to Do It

Oct 12, 2021 | Greg Caswell

Counterfeit components have been defined as a growing concern in recent years as demand increases for reducing costs. In fact the Department of Commerce has identified a 141% increase in the last three years alone. A counterfeit is any item that is not as it is represented with the intention to deceive its buyer or user. The misrepresentation is often driven by the known presence of defects or other inadequacies in regards to performance. Whether it is used for a commercial, medical or military application, a counterfeit component could cause catastrophic failure at a critical moment....

Publisher: DfR Solutions

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

University of Connecticut

Advanced Physical Inspection Methods for Counterfeit IC Detection

Oct 12, 2021 | Sina Shahbazmohamadi, Domenic Forte, and Mark Tehranipoor

The remarkable increase in counterfeit parts (a factor of 4 since 2009) [1] is a huge reliability and security concern in various industries ranging from automotive electronics to sensitive military applications increasing the possibility of premature failure in critical systems [2-5]. Counterfeit parts can also incur a great financial loss to legitimate electronics companies [6]. The issue is even more alarming as the counterfeiters use more sophisticated methods making counterfeit detection a much harder task [7-8]. Therefore, it is reasonable to develop more advanced counterfeit detection methods targeting a more efficient detection of sophisticated counterfeited parts....

Publisher: University of Connecticut

The University of Connecticut is a public land-grant research university in Storrs, Connecticut. It was founded in 1881. The primary 4,400-acre campus is in Storrs, Connecticut, approximately a half hour's drive from Hartford and

Storrs, Connecticut, USA