Stencil Design Using Regression:Following IPC 7525 a Way Better
Published: |
March 25, 2010 |
Author: |
Subrat Prajapati; Process Engineering Larsen & Toubro Limited, Medical Equipment and Systems (EBG) |
Abstract: |
The complexity of Printed Circuit Assembly process is increasing day by day and causing productivity issues in the industry, introducing ultra fine pitch components (pitch less than 15mil) in PCA is a challenge to minimize risk of defects as solder short, dry solder. This paper is focusing on minimizing these defects.... |
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