Effect Of Squeegee Blade On Solder Paste Print Quality
Published: |
June 17, 2010 |
Author: |
Rita Mohanty, Bill Claiborne; Speedline Technologies | Frank Andres; Cookson Electronics |
Abstract: |
The solder paste deposition process is viewed by many in the industry as the leading contributor of defects in the Surface Mount Technology (SMT) assembly process. As with all manufacturing processes, solder paste printing is subject to both special and common cause variation. Just like using graduated cylinders from distinctly different manufacturing processes to measure a volume of liquid, using different blades types can contribute significant special cause variation to a process. Understanding the significant differences in print performance between blade types is an important first step to establishing a standard blade for an SMT process.... |
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