Voiding Control for QFN Assembly
Published: |
April 7, 2011 |
Author: |
Derrick Herron, Dr. Yan Liu, and Dr. Ning-Cheng Lee |
Abstract: |
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size, such as a near die-sized footprint, thin profile, and light weight; (2) easy PCB t... |
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