Manufacturing Substrates with Embedded Passives

Published:

May 5, 2011

Author:

R. N. Das, K. I. Papathomas J. M. Lauffer, S. Rosser, M. D. Poliks, V. R. Markovich

Abstract:

Passives account for a very large part of today’s electronic assemblies. This is particularly true for digital products such as cellular phones, camcorders, and computers. Market pressures for new products with more features, smaller size and lower cost v...

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Company Information:

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Manufacturer

  • Phone 866 820-4820
  • Fax 607 755-7000

See Company Website »

Company Postings:

(3) products in the catalog

(20) technical library articles

(26) news releases

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