Defect freeQFN Assembly
Published: |
June 9, 2011 |
Author: |
Brian J. Leach |
Abstract: |
QFN Description: A QFN package is a QUAD-FLAT-NO LEAD device. This package is small and lightweight and has no leads (unlike a gull wing or J-leaded device). QFN’s have a thermal pad (paddle) on the bottom side of the part that offers heat dissipation and... |
|
|
|
|
|
|
You must be a Company Information:
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
Defect freeQFN Assembly article has been viewed 451 times
