Near Term Solutions For 3D Packaging Of High Performance DRAM
Published: |
September 15, 2011 |
Author: |
Vern Solberg, Wael Zohni |
Abstract: |
The revolution in performance driven electronic systems continues to challenge the IC packaging industry. To enable the new generations of processors to reach their performance potential many manufacturers have developed interface formats to enable greater memory bandwidth. To ensure that the memory functions are able to support the increased signal speed, package developers are relying more and more on innovative 3D package assembly techniques and process refinement.... |
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