Reliability of BGA Solder Joints after Re-Balling Process
Published: |
October 4, 2012 |
Author: |
M.H. Biglaria, A. Nazariana, R. Denteneera, M. Biglari, Jra, A.A. Kodentsov |
Abstract: |
First published in the 2012 IPC APEX EXPO technical conference proceedings... Due to the obsolescence of SnPb BGA components, electronics manufacturers that use SnPb solder paste either have to use lead-free BGAs and adjust the reflow process or re-ball t... |
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Reliability of BGA Solder Joints after Re-Balling Process article has been viewed 561 times
davef
October 9, 2012
How much more time and temperature in the reflow temperature recipe is required for proper mixing of the SnPb solder with the SAC ball, as compared with reflowing a SAC ball with SAC solder?