A Novel High Thermal Conductive Underfill For Flip Chip Appliation
Published: |
February 27, 2014 |
Author: |
Dr. Mary Liu and Dr. Wusheng Yin |
Abstract: |
Silicon dioxide is normally used as filler in underfill. The thermal conductivity of underfill is less than 1 w/mk, which is not able to meet the current flip chip application requirements such as 3D stacked multi-chips packaging. No matter which direction the heat will be dissipated through PCB or chip, the heat has to pass through the underfill in 3D stacked chips. Therefore the increase of thermal conductivity of underfill can significantly enhance the reliability of electronic devices, particularly in 3D package devices... |
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