Novel Approaches for Minimizing Pad Cratering
Published: |
October 29, 2015 |
Author: |
Chen Xu, Yunhu Lin; Alcatel-Lucent, Yuan Zeng, Pericles A. Kondos; Unovis-Solutions. |
Abstract: |
With the electronic industry moving towards lead-free assembly, traditional SnPb-compatible laminates need to be replaced with lead-free compatible laminates that can withstand the higher reflow temperature required by lead-free solders. Lead-free compatible laminates with improved heat resistance have been developed to meet this challenge but they are typically more brittle than SnPb laminates causing some to be more susceptible to pad cratering. In this paper, two novel approaches for minimizing pad cratering will be discussed. Preliminary results which validate the two approaches will also be presented.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from Alcatel-Lucent »
- Mar 24, 2016 - High Frequency DK and DF Test Methods Comparison High Density Packaging User Group (HDP) Project
- Jun 21, 2012 - The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array
- May 06, 1999 - Silicon Microelectronics Technology
- May 06, 1999 - The Future of Solid-State Electronics
- May 06, 1999 - The History of the Microprocessor
- See all SMT / PCB technical articles from Alcatel-Lucent »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
Novel Approaches for Minimizing Pad Cratering article has been viewed 622 times
