Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift
Published: |
September 7, 2017 |
Author: |
Young K. Song and Vanja Bukva |
Abstract: |
As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized.... |
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