Optimization of Stencil Apertures to Compensate for Scooping During Printing
Published: |
March 7, 2018 |
Author: |
Gabriel Briceno, Ph. D., Miguel Sepulveda |
Abstract: |
This study investigates the scooping effect during solder paste printing as a function of aperture width, aperture length and squeegee pressure. The percent of the theoretical volume deposited depends on the PWB topography. A typical bimodal percent volume distribution is attributed to poor release apertures and large apertures, where scooping takes place, yielding percent volumes <100%, while SMD apertures and apertures near PWB features that raise the stencil yield percent volumes >100%. This printing experiment is done with a concomitant validation of the printing process using standard 3D Solder Paste Inspection (SPI) equipment.... |
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