Moisture Absorption Properties of Laminates Used in Chip Packaging Applications
Published: |
November 29, 2020 |
Author: |
Gordon Smith, Nancy Androff, and Jeff Kamla |
Abstract: |
Plastic laminates are increasingly used as interposers within chip packaging applications. As a component within the package, the laminate is subjected to package moisture sensitivity testing. The moisture requirements of chip packaging laminates are related to ambient moisture absorption and thermal cycling. Printed wiring board (PWB) laminates, however, are gauged on properties relating to wet processes such as resist developing, copper etching, and pumice scrubbing. Consequently, printed wiring board moisture absorption test methods differ from chip packaging test conditions.... |
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