MPPE/SEBS Composites with Low Dielectric Loss for High-Frequency Copper Clad Laminates Applications
Published: |
March 4, 2021 |
Author: |
Jianming Guo, Hao Wang, Caixia Zhang, Qilong Zhang, and Hui Yang |
Abstract: |
Copper clad laminates (CCLs) with low dissipation factor (Df) are urgently needed in the fields of high-frequency communications devices. A novel resin matrix of modified poly (2,6-dimethyl-1,4- phenylene ether) (MPPE) and styrene-ethylene/butylene-styrene (SEBS) was employed in the fabrication of high-frequency copper clad laminates (CCLs). The composites were reinforced by E-glass fabrics, which were modified with phenyltriethoxysilane (PhTES). The composite laminates obtained exhibited impressive dielectric loss of 0.0027 at 10 GHz when the weight ratio of MPPE to SEBS was 5:1.... |
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