Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics
Published: |
August 18, 2021 |
Author: |
Nagarajan Palavesam , Waltraud Hell, Andreas Drost, Christof Landesberger, Christoph Kutter and Karlheinz Bock |
Abstract: |
The growing interest towards thinner and conformable electronic systems has attracted significant attention towards flexible hybrid electronics (FHE). Thin chip-foil packages fabricated by integrating ultra-thin monocrystalline silicon integrated circuits (ICs) on/in flexible foils have the potential to deliver high performance electrical functionalities at very low power requirements while being mechanically flexible.... |
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