Thermal Engineering Overview.
Published: |
May 6, 1999 |
Author: |
Craig Johnston, Gary Kuzmin, Aavid Engineering, Inc. |
Abstract: |
The present problem with cooling microprocessors is a relatively new issue -- about 4 years old. It stems from the collision of two conflicting trends -- end-user desire for more powerful microprocessors to run the next generation software, and the equally strong demand for smaller, more mobile computer form factors. With each, the introduction of faster next-generation semiconductors aimed at improving computing power, heat concentration problems increase.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from Aavid Thermalloy, LLC »
- Jul 20, 1999 - How to Select a Heat Sink
- May 06, 1999 - The Thermal Side of 64-Bit Processing
- May 06, 1999 - Thermal Management of Electrolytic Capacitors
- May 06, 1999 - Miniaturization of Cooling Solutions
- May 06, 1999 - The Basics of Package/Device Cooling
- See all SMT / PCB technical articles from Aavid Thermalloy, LLC »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
Thermal Engineering Overview. article has been viewed 644 times
