Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate
Published: |
October 25, 2007 |
Author: |
Michael J. Rowlands, Rabindra Das. |
Abstract: |
More and more substrate designs require signals paths that can handle multi-gigahertz frequencies [1-3]. The challenges for organic substrates, in meeting these electrical requirements, include using high-speed, low-loss materials, manufacturing precise structures and making a reliable finished product. A new substrate technology is presented that addresses these challenges.... |
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