A Case Study in Troubleshooting Shop Floor Rework Difficulties
Published: |
April 5, 2007 |
Author: |
Martin Hogner; Martin Rework and Dispense Technic, Wessling/Munich, Germany, and Allen Sirois; Web Administrator, Manncorp Inc., USA. |
Abstract: |
Recently a large global player approached us with a problem. They needed an initial assembly solution for brand new components. Their boards and CSP specimens could not safely be soldered due to wetting problems at the solder joints.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from MARTIN (a Finetech company) »
- Jul 11, 2013 - Effect of BGA Reballing and its Influence on Ball Shear Strength
- See all SMT / PCB technical articles from MARTIN (a Finetech company) »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
A Case Study in Troubleshooting Shop Floor Rework Difficulties article has been viewed 542 times
