Component Failure Analysis - Hermetic Packaging
Published: |
June 11, 2019 |
Author: |
ACI Technologies, Inc. |
Abstract: |
Recently ACI Technologies was asked to perform failure analysis on a hermetically sealed transistor for potential electrostatic discharge (ESD) or electrostatic overstress (EOS). ACI was asked to determine if the field-failed transistor was damaged by ESD or EOS. In order to properly assess the failure, additional samples were requested.... |
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