Thermal Reliability of Laser Ablated Microvias and Standard Through-Hole Technologies as a Function of Materials and Processing
Published: |
December 21, 2021 |
Author: |
Todd Young, Frank Polakovic and Michael Carano |
Abstract: |
High Density Interconnect (HDI) technologies are being used widely in Asia and Europe in consumer electronics for portable wireless communication and computing, digital imaging, and chip packaging. Although North America lags behind in developing process capability for this technology, HDI will become a significant business segment for North America. For this to happen, the printed circuit board shops will have to become process capable in fabricating fine lines and spaces, and also be capable in forming and plating microvias.... |
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