Effect of Surface Oxide on the Melting Behavior of Lead-Free Solder Nanowires and Nanorods
Published: |
July 18, 2013 |
Author: |
Fan Gao, Karunaharan Rajathurai, Qingzhou Cui, Guangwen Zhou, Irene NkengforAcha, Zhiyong Gu |
Abstract: |
Lead-free nanosolders have shown promise in nanowire and nanoelectronics assembly. Among various important parameters, melting is the most fundamental property affecting the assembly process. Here we report that the melting behavior of tin and tin/silver nanowires and nanorods can be significantly affected by the surface oxide of nanosolders.... |
|
|
|
|
|
|
You must be a Company Information:
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
Effect of Surface Oxide on the Melting Behavior of Lead-Free Solder Nanowires and Nanorods article has been viewed 503 times
