Method for the Manufacture of an Aluminum Substrate PCB and its Advantages

Published:

September 17, 2015

Author:

Joseph Fjelstad

Abstract:

RoHS legislated restrictions on the materials used in electronics manufacture have imparted significant challenges on the electronics industry since their introduction in 2006. The greatest impacts have been felt by the mandated elimination of lead from electronic solder followed by the demand for the elimination of haloids from flame retardants used in traditional PCB laminates. In the years which have followed the electronics industry has been beset with a host of new challenges in its effort to comply. Failure mechanisms, both new and old, have surfaced which demand solution and the industry suppliers and manufacturing technologists have worked diligently to remedy those vexing faults through the development of a wide range of new materials and equipment for both board manufacture and assembly, along with modifications to the processes used in the manufacture and assembly of printed circuit boards....

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Company Information:

Pioneers in the area of solderless assembly technology and originators of the OCCAM process. Developing IP for next and future generations of high reliability and better performing electronic products.

Seattle, Washington, USA

Manufacturer

  • Phone (206) 351-8943

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Company Postings:

(1) technical library article

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