Nanocopper Based Paste for Solid Copper Via Fill
Published: |
March 3, 2016 |
Author: |
David Ciufo, Sujatha Ramanujan, Janet Heyen, Michael Carmody; Intrinsiq Materials, Sunny Patel; Candor Industries. |
Abstract: |
This paper discusses a nano copper based paste for use in via filling. The company manufactures nano copper and disperses the coated nano copper into a paste in combination with micron copper. The resultant paste is injected or fills a via. The via is subsequently sintered by means of photonic sintering, or by heat in a reducing environment. The process will be accomplished in under an hour and results in filled solid copper vias.... |
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