Effects of Assebly Process Variables on Voiding at a Thermal Interface.
Published: |
April 4, 2007 |
Author: |
Muffadal Mukadam, Jeff Schake, Peter Borgesen, Krishnaswami Srihari. |
Abstract: |
The present work offers a discussion and a first case study to identify and illustrate voiding mechanisms for a particular TIM between a heat spreader and the back of a flip chip. Pronounced differences were observed between stencil printing and dispensing in terms of initial void formation, apparently related to the specific properties of the material. Measurements of the effects of heat ramp rate and peak temperature showed the subsequent evolution and final void size distribution to be determined by the initial part of the cure profile up to the material gelling temperature.... |
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