A High Performance and Cost Effective Molded Array Package Substrate
Published: |
November 18, 2010 |
Author: |
Philip Rogren, Pierangelo Magni, Maura Mazzola, Mark Shaw, Giovanni Graziosi, Claudio Maria Villa |
Abstract: |
In this article we present both a relatively new and innovative family of packages that is suitable for medium pin count needs and an innovative method for fabricating the substrates for such a package. With respect to lead count, this packaging family is... |
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