The Application of Spherical Bend Testing to Predict Safe Working Manufacturing Process Strains
Published: |
January 9, 2013 |
Author: |
John McMahon P.Eng, Brian Gray P.Eng, |
Abstract: |
The increased temperatures associated with lead free processes have produced significant challenges for PWB laminates. Newly developed laminates have different curing processes, are commonly filled with ceramic particles or micro-clays and can have higher Tg values. These changes designed to reduce Z-axis expansion and improve the materials resistance to thermal excursions through primary attach and rework operations have also produced harder resin systems with reduced fracture toughness.... |
|
Company Information:
More articles from Celestica Corporation »
- Sep 08, 2021 - The Great SAC Debate: Comparing The Reliability Of SAC305 And SAC405 Solders In A Variety Of Applications
- Feb 28, 2018 - Deposition of Solder Paste into High Density Cavity Assemblies
- Aug 20, 2015 - Implementing Robust Bead Probe Test Processes into Standard Pb-Free Assembly
- Jan 17, 2013 - Solving the ENIG Black Pad Problem: An ITRI Report on Round 2
- See all SMT / PCB technical articles from Celestica Corporation »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
The Application of Spherical Bend Testing to Predict Safe Working Manufacturing Process Strains article has been viewed 704 times