No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability
Published: |
April 11, 2013 |
Author: |
Eric Bastow |
Abstract: |
With the explosion of growth in handheld electronics devices, manufacturers have been forced to look for ways to reinforce their assemblies against the inevitable bumps and drops that their products experience in the field. One method of reinforcement has been the utilization of underfills to "glue" certain SMDs to the PCB. Bumped SMDs attached to the PCB with a no-clean soldering process offer the unavoidable scenario of the underfill coming in contact with a flux residue. This may or may not create a reliability issue... First published in the 2012 IPC APEX EXPO technical conference proceedings... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Indium Corporation »
- Dec 29, 2020 - D-PAK Voiding: A Study to Determine the Origins of D-PAK Voiding
- Nov 24, 2020 - The Risk And Solution For No-Clean Flux Not Fully Dried Under Component Terminations the Risk And Solution For No-Clean Flux Not Fully Dried Under Component Terminations
- Jul 24, 2019 - Voiding Performance with Solder Pastes Containing Modified SAC Alloys for Automotive Applications in Bottom Terminated Component Assemblies
- Dec 19, 2018 - Process Optimization for Fine Feature Solder Paste Dispensing
- Nov 20, 2018 - Understanding the Effect of Different Heating Cycles on Post-Soldering Flux Residues and the Impact on Electrical Performance
- See all SMT / PCB technical articles from Indium Corporation »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability article has been viewed 613 times