The Long-term Shaping of the JTAG/Boundary-scan Standards
Published: |
May 11, 2015 |
Author: |
Peter van den Eijnden, MD JTAG Technologies. |
Abstract: |
Originating from the last millenium, almost three decades ago, the introduction of surface mount packaging triggered a wave of changes throughout many aspects of electronics production. A small number of talented, innovative test engineers from various big players of the industry started to attend meetings to discuss the impact of that change of technology on their future test concepts for modern assemblies. The Joint Test Action Group was born.... |
|
Company Information:
More articles from JTAG Technologies B. V. »
- May 20, 2010 - Testing Digital Designs – The Boundary-scan Balance
- See all SMT / PCB technical articles from JTAG Technologies B. V. »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
The Long-term Shaping of the JTAG/Boundary-scan Standards article has been viewed 546 times